Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices (Record no. 58211)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02060naaaa2200277uu 4500 |
| 001 - CONTROL NUMBER | |
| control field | https://directory.doabooks.org/handle/20.500.12854/38106 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781420059137 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1201/9781420059137 |
| Terms of availability | doi |
| 041 0# - LANGUAGE CODE | |
| Language code of text/sound track or separate title | English |
| 042 ## - AUTHENTICATION CODE | |
| Authentication code | dc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TBN |
| Source | bicssc |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Paik, Ungyu |
| Relationship | auth |
| 245 10 - TITLE STATEMENT | |
| Title | Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Name of publisher, distributor, etc. | Taylor & Francis |
| Date of publication, distribution, etc. | 20090220 |
| 506 0# - RESTRICTIONS ON ACCESS NOTE | |
| Terms governing access | Open Access |
| Source of term | star |
| Standardized terminology for access restriction | Unrestricted online access |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance. |
| 540 ## - TERMS GOVERNING USE AND REPRODUCTION NOTE | |
| Terms governing use and reproduction | Creative Commons |
| Use and reproduction rights | https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode |
| Source of term | cc |
| -- | https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode |
| 546 ## - LANGUAGE NOTE | |
| Language note | English |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Nanotechnology |
| Source of heading or term | bicssc |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | Material Sciences |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Park, Jea-Gun |
| Relationship | auth |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Host name | www.oapen.org |
| Uniform Resource Identifier | <a href="https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf">https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf</a> |
| Access status | 0 |
| Public note | DOAB: download the publication |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Host name | www.oapen.org |
| Uniform Resource Identifier | <a href="https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf">https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf</a> |
| Access status | 0 |
| Public note | DOAB: download the publication |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Host name | www.oapen.org |
| Uniform Resource Identifier | <a href="https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf">https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf</a> |
| Access status | 0 |
| Public note | DOAB: download the publication |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Host name | www.oapen.org |
| Uniform Resource Identifier | <a href="https://directory.doabooks.org/handle/20.500.12854/38106">https://directory.doabooks.org/handle/20.500.12854/38106</a> |
| Access status | 0 |
| Public note | DOAB: description of the publication |
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