Heat Transfer : Engineering Applications

By: Contributor(s): Material type: ArticleArticleLanguage: English Publication details: IntechOpen 2011Description: 1 electronic resource (414 p.)ISBN:
  • 2434
  • 9789533073613
  • 9789535160861
Subject(s): Online resources: Summary: Heat transfer is involved in numerous industrial technologies. This interdisciplinary book comprises 16 chapters dealing with combined action of heat transfer and concomitant processes. Five chapters of its first section discuss heat effects due to laser, ion and plasma-solid interaction. In eight chapters of the second section engineering applications of heat conduction equations to the curing reaction kinetics in manufacturing process, their combination with mass transport or ohmic and dielectric losses, heat conduction in metallic porous media and power cables are considered. Analysis of the safety of mine hoist under influence of heat produced by mechanical friction, heat transfer in boilers and internal combustion engine chambers, management for ultrahigh strength steel manufacturing are described in this section as well. Three chapters of the last third section are devoted to air cooling of electronic devices.
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Heat transfer is involved in numerous industrial technologies. This interdisciplinary book comprises 16 chapters dealing with combined action of heat transfer and concomitant processes. Five chapters of its first section discuss heat effects due to laser, ion and plasma-solid interaction. In eight chapters of the second section engineering applications of heat conduction equations to the curing reaction kinetics in manufacturing process, their combination with mass transport or ohmic and dielectric losses, heat conduction in metallic porous media and power cables are considered. Analysis of the safety of mine hoist under influence of heat produced by mechanical friction, heat transfer in boilers and internal combustion engine chambers, management for ultrahigh strength steel manufacturing are described in this section as well. Three chapters of the last third section are devoted to air cooling of electronic devices.

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