TY  - GEN
AU  - Paik,Ungyu
AU  - Park,Jea-Gun
TI  - Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices
SN  - 9781420059137
PY  - 2009///0220
PB  - Taylor & Francis
KW  - Nanotechnology
KW  - bicssc
KW  - Material Sciences
N1  - Open Access
N2  - Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance
UR  - https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf
UR  - https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf
UR  - https://library.oapen.org/bitstream/20.500.12657/25193/1/1004898.pdf
UR  - https://directory.doabooks.org/handle/20.500.12854/38106
ER  -