000 01935naaaa2200361uu 4500
001 https://directory.doabooks.org/handle/20.500.12854/50197
005 20220220054427.0
020 _aKSP/1000086125
020 _a9783731508533
024 7 _a10.5445/KSP/1000086125
_cdoi
041 0 _aEnglish
042 _adc
100 1 _aMishra, Nilesha
_4auth
245 1 0 _aInfluence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
260 _bKIT Scientific Publishing
_c2019
300 _a1 electronic resource (X, 127 p. p.)
506 0 _aOpen Access
_2star
_fUnrestricted online access
520 _aInk-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
540 _aCreative Commons
_fhttps://creativecommons.org/licenses/by-sa/4.0/
_2cc
_4https://creativecommons.org/licenses/by-sa/4.0/
546 _aEnglish
653 _aelektromechanische Charakterisierung
653 _aflexible Elektronik
653 _athin-film devices
653 _aInk-jet printing
653 _aflexible electronics
653 _asynchrotron X-ray diffraction
653 _aDünnschichtbauteil
653 _aInk-jet drucken
653 _aSynchrotron-Röntgenbeugung
653 _aelectro-mechanical characterization
856 4 0 _awww.oapen.org
_uhttps://www.ksp.kit.edu/9783731508533
_70
_zDOAB: download the publication
856 4 0 _awww.oapen.org
_uhttps://directory.doabooks.org/handle/20.500.12854/50197
_70
_zDOAB: description of the publication
999 _c68611
_d68611