| 000 | 01742naaaa2200349uu 4500 | ||
|---|---|---|---|
| 001 | https://directory.doabooks.org/handle/20.500.12854/53522 | ||
| 005 | 20220220060550.0 | ||
| 020 | _aKSP/1000069365 | ||
| 020 | _a9783731506676 | ||
| 024 | 7 |
_a10.5445/KSP/1000069365 _cdoi |
|
| 041 | 0 | _aGerman | |
| 042 | _adc | ||
| 100 | 1 |
_aGöttel, Benjamin _4auth |
|
| 245 | 1 | 0 | _aMillimeterwellen On-Chip Antennensysteme für die Integration in SoC Applikationen |
| 260 |
_bKIT Scientific Publishing _c2017 |
||
| 300 | _a1 electronic resource (XV, 181 p. p.) | ||
| 506 | 0 |
_aOpen Access _2star _fUnrestricted online access |
|
| 520 | _aIn this work antenna systems for radar- and communication systems are presented. Additionally, a QFN-based packaging concept is evaluated. For communication systems the antenna systems are optimized for maximum radiated power to extend the transmit range. Therefore, a new concept for the power-combination of parallelized amplifiers is presented, where the signals of the amplifiers are combined in a single antenna element. | ||
| 540 |
_aCreative Commons _fhttps://creativecommons.org/licenses/by-sa/4.0/ _2cc _4https://creativecommons.org/licenses/by-sa/4.0/ |
||
| 546 | _aGerman | ||
| 653 | _aMillimeter-Wave | ||
| 653 | _aAntennensysteme | ||
| 653 | _aLeistungskombination | ||
| 653 | _aGehäuseintegration | ||
| 653 | _aPower-Combining | ||
| 653 | _aOn-Chip Integration | ||
| 653 | _aMillimeterwellen | ||
| 653 | _aPackaging Solutions | ||
| 653 | _aAntenna Systems | ||
| 856 | 4 | 0 |
_awww.oapen.org _uhttps://www.ksp.kit.edu/9783731506676 _70 _zDOAB: download the publication |
| 856 | 4 | 0 |
_awww.oapen.org _uhttps://directory.doabooks.org/handle/20.500.12854/53522 _70 _zDOAB: description of the publication |
| 999 |
_c69623 _d69623 |
||