| 000 | 03737naaaa2200817uu 4500 | ||
|---|---|---|---|
| 001 | https://directory.doabooks.org/handle/20.500.12854/47744 | ||
| 005 | 20220220073300.0 | ||
| 020 | _abooks978-3-03897-829-9 | ||
| 020 | _a9783038978299 | ||
| 020 | _a9783038978282 | ||
| 024 | 7 |
_a10.3390/books978-3-03897-829-9 _cdoi |
|
| 041 | 0 | _aEnglish | |
| 042 | _adc | ||
| 100 | 1 |
_aMartinez, Ramses V. _4auth |
|
| 245 | 1 | 0 | _aFlexible Electronics: Fabrication and Ubiquitous Integration |
| 260 |
_bMDPI - Multidisciplinary Digital Publishing Institute _c2019 |
||
| 300 | _a1 electronic resource (160 p.) | ||
| 506 | 0 |
_aOpen Access _2star _fUnrestricted online access |
|
| 520 | _aFlexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage. | ||
| 540 |
_aCreative Commons _fhttps://creativecommons.org/licenses/by-nc-nd/4.0/ _2cc _4https://creativecommons.org/licenses/by-nc-nd/4.0/ |
||
| 546 | _aEnglish | ||
| 653 | _ahydrophobic paper | ||
| 653 | _an/a | ||
| 653 | _aconformal design | ||
| 653 | _astretchability | ||
| 653 | _astretchable circuits | ||
| 653 | _along-term plasticity | ||
| 653 | _atunnel encapsulation | ||
| 653 | _abio-integrated devices | ||
| 653 | _aepidermal sensors | ||
| 653 | _aartificial synapses | ||
| 653 | _adroplet circuits | ||
| 653 | _astretchable electronics | ||
| 653 | _aisland-bridge | ||
| 653 | _abottom-up approaches | ||
| 653 | _aliquid metal | ||
| 653 | _afeedback control | ||
| 653 | _adurability | ||
| 653 | _adry/wet conditions | ||
| 653 | _asolution electronics | ||
| 653 | _anano-fabrication | ||
| 653 | _asurface plasmon-polariton (SPP) | ||
| 653 | _aelectronic measurements | ||
| 653 | _aPolyvinyl Alcohol | ||
| 653 | _awireless power | ||
| 653 | _aquantum tunneling effect | ||
| 653 | _alow-cost manufacture | ||
| 653 | _anon-developable surface | ||
| 653 | _atop-down approaches | ||
| 653 | _areliability | ||
| 653 | _amicrowave photonics | ||
| 653 | _atissue adhesives | ||
| 653 | _atemperature sensor | ||
| 653 | _abrain-like intelligence | ||
| 653 | _aelectron transport | ||
| 653 | _awearable stimulators | ||
| 653 | _avariable optical attenuator (VOA) | ||
| 653 | _aionic conduction | ||
| 653 | _adesign metrics | ||
| 653 | _aflexible electronics | ||
| 653 | _aflexible organic electronics | ||
| 653 | _asoft biological tissue | ||
| 653 | _aneuromorphic computing | ||
| 653 | _awearable heater | ||
| 653 | _aquantum computing | ||
| 653 | _aepidermal electronics | ||
| 653 | _atunable adhesion | ||
| 653 | _apaper electronics | ||
| 856 | 4 | 0 |
_awww.oapen.org _uhttps://mdpi.com/books/pdfview/book/1306 _70 _zDOAB: download the publication |
| 856 | 4 | 0 |
_awww.oapen.org _uhttps://directory.doabooks.org/handle/20.500.12854/47744 _70 _zDOAB: description of the publication |
| 999 |
_c73507 _d73507 |
||